Pecht, Michael

Michael Pecht

Chair Professor and Director

Center for Advanced Life Cycle Engineering (CALCE)

A. James Clark School of Engineering

Phone: 
301-405-5323

Statement of energy interests and expertise: 

Prof. Michael Pecht is a world renowned expert in strategic planning, design, test, and risk assessment of information systems. Prof Pecht has a BS in Physics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at Madison. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, an SAE Fellow and an IMAPS Fellow. He is the editor-in-chief of IEEE Access, and served as chief editor of the IEEE Transactions on Reliability for nine years, and chief editor for Microelectronics Reliability for sixteen years. He is currently a Chair Professor in Mechanical Engineering and a Professor in Applied Mathematics, Statistics and Scientific Computation at the University of Maryland.

Also, he is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He has written over 700 technical articles and has 7 patents. Prof. Pecht has been leading a research team in the area of prognostics for the past ten years, and has now formed a new Prognostics and Health Management Consortium at the University of Maryland, and has consulted for over 50 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems.

In 2011, he received the University of Maryland’s Innovation Award for his new concepts in risk management. In 2010, he received the IEEE Exceptional Technical Achievement Award for his innovations in the area of prognostics and systems health management. In 2008, he was awarded the highest reliability honor, the IEEE Reliability Society’s Lifetime Achievement Award. He has previously received the European Micro and Nano-Reliability Award for outstanding contributions to reliability research, 3M Research Award for electronics packaging, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in electronics analysis.